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Small size: save space, save cost

Simple operation: plug and play, no external cooling system required

Safe and reliable: the system has no liquid, no leakage risk, anti-static

Contact design: The thermal module contacts the surface of the DUT to ensure efficient heat transfer

High precision temperature control: PID algorithm or advanced temperature control module, accurate temperature control

Programming control: The software presets the temperature curve to realize the automatic test process

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Meet the mainstream packaging requirements such as 400G, 800G, 1.6T QSFP-DD and OSFP

Integrated three-temperature temperature control BERT test, highly integration

Compact design, small footprint, can meet the dual station or AOC test needs

Coaxial line free, low impedance

Patented airflow design, use more peace of mind

Wide temperature zone, fast temperature change rate, more efficient test

Air flow heat conduction, efficient heat exchange, no contact no insertion loss